wafer.space Community - Maximum current-carrying capacity for power pads and bonding wires?

Hello everyone, apologies if this has been addressed before, but I am currently designing a power converter and have a couple of questions regarding current limits: 1. What is the maximum current-carrying capacity (or electromigration limit) that the power pads can handle? 2. What is the maximum current (fusing current) that the bonding wires can support? Any documentation or reference values would be greatly appreciated. Thanks in advance!

For (1) there are electromigration limit listed in the PDK doc, you can just apply those to the layout of the pad and estimate it your self.

6:40 p.m.

For (2) the wire used for this run was AlSi1% 1mil

tnt

For (2) the wire used for this run was AlSi1% 1mil

I believe it's actually 0.8mil?

@Tim 'mithro' Ansell Ah maybe ... looking back at the pics you took one says 1 mil the other 0.8

I think they normally use 1mil but needed to use 0.8mil for our parts.

Tim 'mithro' Ansell

I think they normally use 1mil but needed to use 0.8mil for our parts.

Yeah you said that and that it's like 5x or something the cost (for the Al wire)